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本文详细研究了高锡含量锗锡合金(Ge_(0.92)Sn_(0.08))与镍在退火条件下的反应。通过表层电阻测试、原子力显微镜和透射电镜等表征手段,我们分别研究了镍锗锡材料在300℃、400℃、500℃温度下退火后的表面和界面形貌。研究表明:与镍和锗反应相比,镍和锗锡材料反应生成的镍锗锡薄膜热稳定性变差,退火温度400℃后镍锗锡薄膜表层电阻就迅速增加,样品表面变得不连续,团聚为平均长度200nm左右的岛状晶粒,样品表面和界面与电学性质都遭到了破坏。
In this paper, the reaction of high tin content germanium-tin alloy (Ge_ (0.92) Sn_ (0.08)) with nickel under annealing condition was studied in detail. By surface resistance test, atomic force microscopy and transmission electron microscopy and other means of characterization, we studied the nickel-germanium-tin material surface and interface morphology after annealing at 300 ℃, 400 ℃, 500 ℃. The results show that compared with nickel and germanium, the thermal stability of nickel-germanium-tin thin films formed by the reaction of nickel and germanium-tin materials deteriorates. The surface resistance of the nickel-germanium-tin thin films increases rapidly after annealed at 400 ℃, and the surface of the samples becomes discontinuous , Reunited as the average length of about 200nm island-shaped grains, the sample surface and interface and electrical properties have been destroyed.