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对湿法刻蚀和键合两个芯片制作关键步骤进行了研究和优化.首先比较了两种刻蚀配方的效果,并对刻蚀时间和刻蚀过程中的振荡方向等条件进行了考察,对键合预处理方法做了进一步改进.通过对常温键合和高温键合方法比较,证明高温键合才能保证芯片的使用寿命.最后将所制得的芯片成功地应用于非变性蛋白质的二维芯片电泳分离.实验结果表明,通过对芯片制作方法的改进,不仅获得了良好的蛋白分离效果,而且芯片制作方法更为简便、成本低、制作成功率提高.
The key steps of wet etching and bonding two chips were studied and optimized.Firstly, the effects of two kinds of etching formulas were compared and the conditions of etching time and oscillation direction during etching were investigated. The bonding pretreatment method was further improved.By comparing the bonding method at room temperature and high temperature, it proved that high temperature bonding could ensure the service life of the chip.Finally, the obtained chip was successfully applied to the second Dimensional chip electrophoresis separation.The experimental results show that not only the good protein separation effect is obtained by the improvement of the chip manufacturing method, but also the chip manufacturing method is more convenient, the cost is lower and the production success rate is improved.