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ｉ线片子步进机正在逐渐成为主流的加工设备，用于实现亚半微米电路图形的转印。因此它就成为批量生产１６Ｍ位ＤＲＡＭ器件，且有可能成为在远紫外设备未引入生产线之前的第一代６４Ｍ位ＤＲＡＭ器件制造的必然选择。然而对于亚半微米的分辨率，就必须具有大数值孔径和大视场的透镜。本文主要介绍了新一代家族的片子步进机。该机采用了一种新设计的机架和模块式结构，它可以接纳同一家族的大视场ｉ线镜头和远紫外镜头。最后叙述了０５４ＮＡ和２５５ｍｍ象场直径的镜头。为克服片子加工中可能出现的焦深问题，设计引入了逐场调平技术，从而保证了使所有象场均处于最佳焦面。用这种选择所面临的问题就是工作台步进和片子工作台灵活调平时对准精度将受到影响。本文介绍的步进机设计思想是为了出片率不受影响，因而在逐场调平后的对准中未采用逐场对准。为此设计了一种新的计量系统并改进了对准精度，从而使总体对准方式的最终套刻精度达到了８５ｎｍ以下，并实现了每小时处理８０枚１５０ｍｍ（６英寸）圆片的生产效率和１级以上的局部环境控制，达到了加工２００ｍｍ（８英寸）圆片的环境净化要求
i-line film stepper is gradually becoming the mainstream processing equipment, used to achieve sub-semi-micron circuit graphics transfer. So it becomes a mass-produced 16M-bit DRAM device and is likely to be the inevitable choice for the first generation 64M-bit DRAM device before the far-UV device is introduced into the production line. However, for sub-micron resolution, it is necessary to have a lens with a large numerical aperture and a large field of view. This article introduces a new generation of family film stepping machine. The machine uses a new design of the rack and modular structure, which can accommodate the same family of large-field i-line lens and far-ultraviolet lens. Finally described the 0 54NA and 25 5mm camera field diameter lens. In order to overcome the possible depth of focus in film processing, the design introduces a field-by-level leveling technique to ensure that all image fields are in the best focal plane. The problem with this choice is that the alignment accuracy will be affected when the stage is stepped and the stage is flexibly adjusted. This article describes the design concept of stepper in order to produce a film rate is not affected, and therefore in the field-by-field alignment is not adjusted by field. To this end, a new metrology system has been designed and alignment accuracy has been improved, resulting in a total nesting accuracy of less than 85 nm for total alignment and processing of 80 150 mm (6 inch) wafers per hour Efficiency and local environmental control at level 1 or above meet the environmental cleanup requirements for processing 200mm (8 inch) wafers