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介绍了ＴＡＢ工艺，包括历史演变，基本的引线键合结构，载带及其制作，缓冲触突与势垒金属层的制作以及内引线和外引线键合。
The TAB process is introduced, including historical evolution, basic wire bonding structure, carrier tape and its fabrication, buffer bumping and barrier metal layer fabrication as well as inner and outer wire bonding.