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对三种铝板的压印接头与压印-粘接复合接头进行拉伸剪切试验,研究基板性能对压印及其复合接头力学性能与失效模式的影响。结果表明:基板性能对压印及其复合接头力学性能有较大影响。当基板强度高时,压印接头强度高且失效位移长,压印-粘接复合接头中粘接剂对压印接头强度影响小,而对失效位移与能量吸收能力影响大。压印接头失效模式均为颈部断裂失效;当基板强度大时,复合接头中粘接层失效模式为混合失效,当基板强度小时,粘接层失效模式为界面失效。
Tensile shear tests were conducted on three types of aluminum stamping and embossing-bonding composite connectors to study the influence of substrate properties on the mechanical properties and failure modes of embossing and composite connectors. The results show that the substrate properties have a great influence on the mechanical properties of stamping and its composite joints. When the substrate strength is high, the embossing joint strength is high and the dislocation displacement is long. The adhesive in the embossing-bonding composite joint has little effect on the strength of the embossing joint, but has a great influence on the displacement displacement and the energy absorbing ability. When the substrate strength is large, the failure mode of the adhesive layer in the composite joint is mixed failure. When the substrate strength is small, the failure mode of the adhesive layer is the interface failure.