厦门市芯光润泽科技有限公司第三代半导体SiC(碳化硅)功率模块研发及产业化项目昨日在翔安高技术园区举行开工仪式,规划总投资20亿元。据悉,该项目占地约40亩,主要进行第三代半导体SiC功率模块的设计、研发及制造,创新发展SiC产业平台和示范基地,是国内先进的SiC功率模块封装厂之一,建成后大功率模块年产能将达1150万套,年产值约40亿元。作为全国领先、全省唯一的碳化硅研发产业化项目,将带动厦门碳化硅全产业链产值超 The third generation of semiconductor SiC (silicon carbide) power module R & D and industrialization project held in Xiamen Xiang An High-tech Park yesterday started the ceremony, planning a total investment of 2 billion yuan. It is reported that the project covers an area of ​​about 40 acres, mainly for the third generation of semiconductor SiC power module design, development and manufacturing, innovation and development of SiC industry platform and demonstration base, is one of the advanced SiC power module packaging plant, built after the large Power module annual production capacity will reach 11,500,000 sets, annual output value of about 4 billion yuan. As the country’s leading, the province’s only silicon carbide R & D industrialization project, will drive the entire industrial chain of silicon carbide output in Xiamen super