通过对玻璃、陶瓷等不同基板板上芯片(COB)封装的发光二极管(LED)的光、电、热参数进行测试与比较,发现玻璃基板COB封装的光通量与陶瓷基板相近。设计了背部刷银层和铝卡口接触的散热方式,改善了玻璃基板COB的导热性能。当银层厚度75μm时,点亮稳定后,LED胶面温度为91.5℃,达到了较好的散热和发光效果。 By testing and comparing the optical, electrical and thermal parameters of COB encapsulated LEDs on glass, ceramic and other substrates, it was found that the luminous flux of the COB package on the glass substrate is similar to that of the ceramic substrate. The design of the back brush silver layer and the aluminum bayonet contact cooling method to improve the thermal conductivity of the glass substrate COB. When the thickness of the silver layer is 75μm, the temperature of the LED glue surface is 91.5 ℃ after the lighting is stable, which achieves good heat dissipation and light emission.