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采用化学还原法制备超细铜粉,通过条件试验研究了铜盐种类(硫酸铜、硝酸铜、乙酸铜、氯化铜)和表面活性剂SDS(全称“十二烷基硫酸钠”)对制备超细铜粉的影响。利用X射线衍射仪、扫描电镜、激光粒度分布仪及数字欧姆表,对超细铜粉的物相、形貌、粒径分布和导电性进行分析。结果表明:添加SDS后,铜粉表面变光滑,粒径分布变窄,松装密度变大,导电性变好。铜盐种类不同,其对铜粉表面、粒径分布、松装密度及导电性等性能影响也不同,其中以硫酸铜为原料制备的铜粉性能最佳,其次是硝酸铜、乙酸铜,性能最差的是氯化铜原料。铜粉性能的差异与反应体系中SDS的作用机理以及铜盐中阴离子半径和浓度有关。
The chemical reduction method was used to prepare ultrafine copper powder. The conditions of the copper salts (copper sulfate, copper nitrate, copper acetate, copper chloride) and SDS (name of sodium dodecyl sulfate) The impact of the preparation of ultrafine copper powder. The phase, morphology, particle size distribution and conductivity of the ultrafine copper powder were analyzed by X-ray diffraction, scanning electron microscopy, laser particle size distribution and digital ohmmeter. The results show that after adding SDS, the surface of copper powder becomes smooth, the particle size distribution becomes narrower, the bulk density becomes larger, and the conductivity becomes better. Different types of copper salts have different effects on copper powder surface, particle size distribution, bulk density and conductivity, among which copper sulfate prepared from copper sulfate is the best, followed by copper nitrate, copper acetate, performance The worst is copper chloride raw material. The differences of copper powder properties are related to the action mechanism of SDS in the reaction system and the anion radius and concentration of copper salts.