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目前,用于小孔加工的主要方法有高速机械钻孔、冲孔、电火花加工、激光加工、电子束加工、电解加工、超声加工等。近年来,由于小孔加工技术吸取了现代科学技术的新成果,不断改进和提高,已经达到相当高的水平,能在硬质合金、金刚石、玻璃、陶瓷等高强度、高硬度和高脆性的金属材料或非金属材料上加工小孔,而且所加工小孔的直径可以小至2～3μ。本文概述了日本、美国、苏联等国在小孔加工方面的进展情况。
Currently, the main methods for the processing of small holes are high-speed mechanical drilling, punching, EDM, laser processing, electron beam processing, electrolytic processing, ultrasonic processing. In recent years, due to the small hole processing technology to learn the new achievements of modern science and technology, continuous improvement and improvement, has reached a very high level, in carbide, diamond, glass, ceramics, high strength, high hardness and high brittleness Metal or non-metallic materials processing holes, and the processing of small holes can be as small as 2 ~ 3μ. This article outlines the progress made by Japan, the United States, the Soviet Union and other countries in the processing of small holes.