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在制作先进的芯片图形时,人们总希望以最低的成本生产最高密度的集成电路。这就导致了混合曝光的新概念。就目前的生产线而论,这种“混合曝光”通常是交替使用1:1的投影掩模对准器和分步重复装置。为了形成器件某一层的图形,是选择投影掩模对准器,还是选择分步重复装置,是这样决定的:要求高的(即关键的)层选用分步重复器,以发挥它的优良的套准和分辨能力;要求不高的(即非关键的)层选用投影掩模对准器,以发挥其较高的生产能力。因而,这种生产线的性能和生产率都是最佳的。
In the production of advanced chip graphics, people always want the lowest cost of producing the highest density of integrated circuits. This led to a new concept of hybrid exposure. For the current production line, this “hybrid exposure” is usually a 1: 1 projection mask aligner and a step-and-repeat device. It is up to the decision whether to project a mask aligner or to choose a step-and-repeat device in order to create a pattern of a layer of the device: to require a high (ie, critical) layer to use a stepper to exert its good Of registration and resolution capabilities; less demanding (ie non-critical) layer selection projection mask aligner to play its higher production capacity. Therefore, the performance and productivity of this production line are the best.