采用轧制技术和真空扩散连接技术,成功实现了Al/Cu阻抗匹配状态方程测试靶的制备,通过原子力显微镜(AFM)、扫描电镜(SEM)、X射线衍射(XRD)、台阶仪等测试方法,对样品结构及表面质量进行分析。结果表明:通过轧制技术制备的金属薄膜表面质量较好,表面粗糙度小于25 nm;扩散连接铝铜薄膜界面结合良好,为连续连接,扩散界面控制在150 nm以内。 The Al / Cu impedance matching equation of state was successfully prepared by using the rolling technology and the vacuum diffusion bonding technique. Through the methods of atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray diffraction (XRD) , The sample structure and surface quality analysis. The results show that the surface quality of the metal thin films prepared by rolling technology is better and the surface roughness is less than 25 nm. The bonding interface of diffusion bonding aluminum-copper thin film is well bonded and continuous connection is achieved, and the diffusion interface is controlled within 150 nm.