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本文研制了一种较高档的磁控溅射镀膜设备,用于微电子器件规模化生产过程中的基片表面镀膜。该设备采用双真空室结构,使溅射室始终维持较高的真空度和洁净度,提高镀膜质量和镀膜效率。环绕溅射室设计了3个直流靶和1个射频靶,能够溅射金属膜、介质膜、混合物和化合物薄膜。文中详述了该设备的设计原理、总体结构及工艺控制方法。该磁控溅射台已开发成功并投入使用,替代了同类进口设备。
In this paper, a higher-grade magnetron sputter coating equipment was developed for the coating of the substrate surface during the mass production of microelectronic devices. The device uses double vacuum chamber structure, so that the sputtering chamber has always maintained a high degree of vacuum and cleanliness, improve coating quality and coating efficiency. Three DC targets and one RF target are designed around the sputtering chamber to sputter metal films, dielectric films, blends and compound films. The paper details the design principle of the device, the overall structure and process control methods. The magnetron sputtering Taiwan has been successfully developed and put into use, replacing similar imported equipment.