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目前,在VLSI圆片加工的光刻工艺中,离开步进投影曝光机就无法对镜头进行完整的评价。由投影镜头的光学成像特性,步进机照明系统,机器调整以及系统和工艺特性引起的圆片上半导体电路图形尺寸和位置的变化,均会影响到图形的套刻和关键尺寸的控制。 显然,对用于VLSI制造中片子步进机镜头的评价,必需在一个较广阔的范围内进行。它包括了系统的对准和套准;镜头之间和机器之间的匹配;一组中间掩模版的套准精度;可达到的实际视埸尺寸;与关键尺寸结果有关的光致抗蚀剂工艺等。在文献1和文献2的报导中,已经强调了这些参数因素结合的重要性。
Currently, the lens can not be evaluated completely without the stepper projection lithography process in VLSI wafer processing lithography. Changes in size and position of the semiconductor circuit on the wafer caused by the optical imaging characteristics of the projection lens, the stepper lighting system, the machine adjustment, and system and process characteristics all affect the overlay and key dimension control of the graphic. Obviously, evaluation of a film stepper lens used in VLSI fabrication must take place over a wider area. It includes the alignment and registration of the system; the matching between the lenses and the machine; the registration accuracy of a set of reticle; the actual visual size that can be achieved; the photoresist in relation to the critical dimension results Technology and so on. In the reports of Document 1 and Document 2, the importance of the combination of these parameter factors has been emphasized.