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利用粉末冶金工艺制备了Cu-TiN复合材料,对复合材料的显微组织和力学性能进行了分析,探讨了不同制备方法对复合材料性能的影响。结果表明,与纯Cu相比,加入TiN后,复合材料电导率明显下降。随着TiN含量的增加,材料的密度、抗拉强度、硬度和电导率降低。真空热压烧结法制备的复合材料的密度、硬度和电导率明显优于冷等静压烧结法制备的复合材料。
The Cu-TiN composite was prepared by powder metallurgy. The microstructure and mechanical properties of the composite were analyzed. The effects of different preparation methods on the properties of the composite were discussed. The results show that compared with pure Cu, the conductivity of composites decreases obviously when TiN is added. As the TiN content increases, the density, tensile strength, hardness and electrical conductivity of the material decrease. The density, hardness and electrical conductivity of the composite prepared by vacuum hot pressing are obviously better than the composite prepared by cold isostatic pressing.