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1月12日下午,第三代半导体电力电子器件模组、封装和散热技术研讨会在北京召开,LED业内三安光电、鸿利光电、英飞凌等企业参加了研讨会。此次研讨会对基于第三代半导体的电力电子器件模组、封装和散热等主要技术的发展趋势和挑战的展开了激烈的讨论,对行业发展具有知道性意义。第三代半导体产业技术创新战略联盟技术委员会专家张国旗教授谈到,对基于第三代半导体的电力电子器件模组、封装和散热等主要技术的发展趋势和
On the afternoon of January 12, the third generation semiconductor power electronics module, packaging and cooling technology seminar was held in Beijing. The LED industry, including San’an Optoelectronics, Hongli Optoelectronics and Infineon, attended the seminar. The seminar on the third generation of semiconductor power electronics modules, packaging and cooling and other major trends in the development and challenges of a heated discussion of the development of the industry has a significant meaning. Third Generation Semiconductor Industry Technology Innovation Strategic Alliance Technical Committee expert Professor Zhang Guobu talked about the third generation of semiconductor-based power electronics module, packaging and cooling and other major trends in technology development and