本文研究了化学镀铜中各种添加剂的作用。对某些含氮基化合物、含氧基化合物、含硫基化合物作为添加剂进行了实验。从实验结果比较了镀液稳定性、析出速度、镀层厚度等特性。从而得出含硫基化合物、含氮基化合物作为添加剂时镀液稳定性好,它们可能和铜离子形成络合物或螯合物,并做了两种添加剂配合使用的镀液稳定性和析出速度实验。另外还探讨了关于添加剂添加量、镀液温度、镀覆时间、镀膜厚度等条件的相互关系。 This paper studies the role of various additives in electroless copper plating. Some nitrogen-containing compounds, oxygen-containing compounds, sulfur-containing compounds as additives were tested. The experimental results compare the bath stability, deposition rate, coating thickness and other characteristics. Thus, the sulfur-containing compounds, nitrogen-containing compounds as additives when the bath stability, they may form complexes with copper ions or chelates, and made two additives used in bath stability and precipitation Speed ​​experiment. In addition, it also discusses the relationship between additive amount, bath temperature, plating time, coating thickness and other conditions.