选用电工纯铁与无氧铜两种组元材料,采用轧制复合工艺制备了Cu-Fe-Cu磁屏叠层材料,对轧合件进行力学性能分析,并运用金相显微镜、扫描电镜、能谱仪等手段分析复合件界面形貌及复合机制。结果表明:采用50%热轧压下率可使铜、铁板有效复合,轧合件内各叠层厚度尺寸稳定、叠层间平行度良好,经简单退火后其叠层间无明显扩散发生,叠层间抗剪切强度达167MPa,此时热轧的主要复合机制为机械啮合。 The electromechanical pure iron and oxygen-free copper are used as the component materials. The Cu-Fe-Cu magnetic screen laminated material is prepared by the rolling compounding process. The mechanical properties of the rolled-in part are analyzed. The microstructure, Spectrometer and other means of analysis of composite interface morphology and composite mechanism. The results show that copper and iron plate can be effectively compounded by 50% hot rolling reduction. The thickness of each stack in the rolled-in part is stable and the parallelism between the layers is good. After simple annealing, no obvious diffusion occurs between the layers. , Anti-shear strength between the stack up to 167MPa, then the main mechanism for the hot-rolled mechanical meshing.