表面组装技术是指在超小型无引线或引线很短的元件直接焊接在印刷电路板表面上的一种技术。它是自半导体发明以来,世界电子工业重大的突破,在国外被誉为“组装革命”。 表面组装技术(简称SMT),不仅带动和促进了电子元器件向片式化、小型化、薄型化、轻量化、高可靠、多功能方向发展,同时也是衡量一个国家科学技术进步程度的标志。 Surface mount technology refers to a very small leadless or very short lead wire soldered directly on the surface of a printed circuit board technology. It is a major breakthrough in the world electronics industry since the invention of the semiconductor and is known as “the assembly revolution” abroad. Surface mount technology (referred to as SMT), not only led to and promote the electronic components to the chip, small, thin, lightweight, high reliability, multi-functional direction, but also a measure of a country’s progress in science and technology mark.