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基于笼型倍半硅氧烷(POSS)的有机-无机杂化纳米复合低介电材料由于具有良好的综合性能,在微电子封装中存在潜在应用。然而目前基于POSS的可聚合单元通常含有髙极性基团,对材料低介电性能造成了不利影响。基于苯并环丁烯(BCB)基团在高性能低介电材料中的独特优势,利用POSS的Heck反应,在POSS上引入BCB官能团,进而制备形成衍生聚合物。核磁氢谱表明成功实现了POSS的BCB官能化,取代率达到约50%。差示热量测试表明BCBPOSS通过[~(2+)4]环加成实现了交联聚合。热重测试表明BCB-POSS交联树脂具有优异的热稳定性能。扫描探针显微镜结果表明BCB-POSS交联树脂薄膜表面光洁性较好,满足微电子应用的基本要求。
Organic-inorganic hybrid nano-composite low dielectric materials based on cage silsesquioxane (POSS) have potential applications in microelectronic packages due to their good overall performance. However, POSS-based polymerisable units usually contain 髙 polar groups, which adversely affect the low dielectric properties of the material. Based on the unique advantages of benzocyclobutene (BCB) groups in high performance and low dielectric materials, BCS functional groups were introduced into POSS by Heck reaction of POSS, and then the derivatized polymers were prepared. Nuclear magnetic resonance spectroscopy showed that BCS functionalization of POSS was successfully achieved with a substitution rate of about 50%. The differential calorimetry tests showed that BCBPOSS achieved cross-linking polymerization via [~ (2+) 4] cycloaddition. Thermogravimetric tests show that BCB-POSS cross-linked resin has excellent thermal stability. Scanning probe microscopy results show that the BCB-POSS cross-linked resin film surface finish better to meet the basic requirements of microelectronics applications.