多层厚膜混合波导联结装置,在装上无源和有源元件前必须测试基片的连续性及水平金属喷镀式样和垂直互连的绝缘性。否则,因为金属图样里有裂缝,这些元件就会象碎屑一样损坏。美国西屋电气公司的工程师已用他们自己的“混合装置”来解决至今探查这些基片的麻烦问题。 Multilayer thick film hybrid waveguide bonding devices must be tested for continuity of the substrate and insulation of the horizontal metallization pattern and vertical interconnect before mounting the passive and active components. Otherwise, because of cracks in the metal pattern, these components will be damaged like debris. Engineers at Westinghouse Electric Company have used their own “hybrid devices” to solve the hassles of probing these substrates to date.