SEMiX是一个现代化的模块平台,在相同的封装中提供了IGBT和整流模块。17mm的扁平封装有各种可扩展的尺寸。结合Spring弹簧连接技术,SEMiX成为第一款在中等功率范围內引入简单、低成本且焊接少的驱动器PCB安装技术的模块。随着SEMiX3p press-fit的推出,Spring产品家族变得更加灵活,可以为创新的逆变器设计提供最高的性能和具有成本效益的生产工艺。通过在相同封装中引入额定电流分别为300A、450A和600A的1200V SEMiX3p press-fit半桥IGBT模块,SEMiX产品系列得以扩展。SEMiX3p press-fit具有经过优化的內部设计,目前有可能在SEMIX3大小的外壳 SEMiX is a modern module platform that offers IGBTs and rectifiers in the same package. The 17mm flat package comes in a variety of scalable sizes. Combined with Spring® spring-bonding technology, the SEMiX ™ becomes the first module to introduce a simple, low-cost, and less-soldered drive PCB mounting technology in the mid-power range. With the introduction of the SEMiX3p press-fit, the Spring product family has become more flexible, providing the highest performance and cost-effective manufacturing processes for innovative inverter designs. The SEMiX product family was expanded by introducing a 1200V SEMiX3p press-fit half-bridge IGBT module rated at 300A, 450A and 600A respectively in the same package. SEMiX3p press-fit with an optimized internal design, it is currently possible in SEMIX  3-size shell