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一、前言 消费类手持产品如移动电话、数码像机等不断减少尺寸和减低重量以满足小型化的需要。不同于传统的有引线器件,倒装芯片(FC)和芯片尺寸封装(CSP)器件作为面阵列器件被表面贴装在印刷线路板上,为了保证组件的可靠性需要寻找两种类型的失效,一种是由冲击或者印刷线路板弯曲引起的脆的折断失效,另一种是由器件与印刷线路板之间综合热膨胀系数的不匹配引起的热疲劳失效,常用材料的热膨胀系数如表1列出,不使用底部填充材料或填入矽土、矾土等粉沫材料能够解
I. Introduction Consumer handheld products such as mobile phones, digital cameras continue to reduce the size and weight to meet the needs of miniaturization. Unlike conventional leaded devices, flip-chip (FC) and chip scale package (CSP) devices are surface-mounted on printed circuit boards as surface-array devices. Two types of failure are sought to ensure component reliability. One is by the impact or printed circuit board bending caused brittle fracture failure, and the other is by the device and the printed circuit board thermal expansion coefficient of thermal mismatch caused by thermal fatigue failure, commonly used materials, thermal expansion coefficient as shown in Table 1 Out, do not use the underfill material or fill in silica, alumina and other powder materials can solve