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再布线圆片级封装通过对芯片焊区的重新构造以及无源元件的集成可以进一步提升封装密度、降低封装成本。再布线圆片级封装器件广泛应用于便携式设备中,在实际的装载、运输和使用过程中抗冲击可靠性受到高度重视。按照JEDEC标准对再布线圆片级封装样品进行了板级跌落试验,首先分析了器件在基板上不同组装点位的可靠性差异;然后依次探讨了不同节距和焊球尺寸、再布线结构对器件可靠性的影响;最后,对失效样品进行剖面制样,采用数字光学显微进行形貌表征。在此基础上,结合有限元分析对再布线结构和铜凸块结构的圆片级封装的可靠性和失效机理进行深入地阐释。
Rewiring Wafer-level packaging By rebuilding the die pads and integrating passive components, packaging density can be further increased and packaging costs can be reduced. Rewiring Wafer-level package devices are widely used in portable devices and are valued for their impact reliability during actual loading, shipping and use. According to the JEDEC standard, the board-level drop test was carried out on the rewiring wafer-level package samples. First, the reliability differences of different assembly points on the substrate were analyzed. Then the different pitches and solder ball sizes were discussed in turn. Device reliability; Finally, the failed samples were sectioned and characterized by digital optical microscopy. On this basis, combined with the finite element analysis, the reliability and failure mechanism of wafer level packaging with rewiring structure and copper bump structure are further explained.