随着电子设备的电路技术和元件技术的发展,组装在印制电路板上的元件其性能扩大,组装密度也飞跃地增高,其结果,元件需要的安装孔增加。而且,更严格地要求孔位置的精度。特别在工业用电子设备领域中使用印制电路板,几乎都使用环氧玻璃布复箔层压板。用钻头钻孔后,在孔壁表面进行镀 With the development of circuit technologies and component technologies of electronic devices, the components mounted on printed circuit boards have been expanded in performance and the assembly density has been dramatically increased. As a result, the number of mounting holes required for components has increased. Moreover, the accuracy of the hole position is more strictly required. Printed circuit boards are used especially in the field of industrial electronic devices, almost all using epoxy glass cloth foil laminates. After drilling with a drill, plating is performed on the surface of the hole wall