针对垂直梳齿静电驱动微光机电系统(MOEMS)芯片制备工艺中,用于静电驱动的固定梳齿和可动梳齿难以精确对准的问题,通过开发一种自对准工艺技术,利用一次光刻和预掩蔽层梳齿定位以及连续两次深反应离子刻蚀(DRIE)工艺,可成功实现固定梳齿和可动梳齿的精确定位.基于该技术制备出的静电梳齿驱动光可调衰减器(VOA)芯片和光开关(OSW)芯片具有良好的光学性能,两款芯片的微镜可分别实现静电驱动电压6和55 V下0.5°及3.0°的角度偏转.结果表明,应用该自对准工艺,使易于加工、低成本且可批量化的芯片制备成为可能.“,”The precise aligning between the electrostatic driven fixed comb and movable comb is considered to be the main issue during the fabricating process of the vertical comb electrostatic driven micro-opto-electro-mechanical system (MOEMS) chip.A self-aligned technique was developed with once photolithography,pre-mask for the comb fixing structure,and then two sequential deep reactive ion etching (DRIE) process,by which the fixed comb and movable comb were precisely aligned successfully.The electrostatic comb driven optical variable attenuator (VOA) and optical switch (OSW) chips of good optical characteristics were fabricated by the technique.The deflection angle of the micro mirror of the VOA chip was 0.5° at 6 V static driving voltage,the deflection angle of the micro mirror of the OSW chip was 3.0° at 55 V static driving voltage.The result shows that the self-aligned technique can be a very promising approach to easily fabricate low-cost mass chips.