论文部分内容阅读
着重探讨了化学镀Ｎｉ－Ｃｕ－Ｐ合金的镀液组成以及化学镀Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层合金的工艺条件，并采用弯曲法研究了化学镀Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层镀层的结合力。结果表明，当Ｎｉ－Ｃｕ－Ｐ合金镀液中的络合剂含量超过其镍盐含量的两倍时，即可抑制置换铜反应的发生，而实现镍、铜离子的共沉积，从而获得良好质量的Ｎｉ－Ｃｕ－Ｐ镀层和Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层镀层。化学镀Ｎｉ－Ｃｕ－Ｐ／Ｎｉ－Ｐ双层镀层因具有相对较佳的内应力分布状态，而有优越的镀层结合力。研究表明，双层化学镀是提高Ｎｉ－Ｐ镀层结合力的一条有效途径。
The composition of electroless Ni-Cu-P alloy plating bath and the process conditions of electroless Ni-Cu-P / Ni-P double-layer alloy were studied. The effects of electroless Ni- P double coating adhesion. The results show that when the content of complexing agent in Ni-Cu-P alloy bath exceeds twice its content of nickel salt, the occurrence of substitutional copper reaction can be restrained, and the co-deposition of nickel and copper ions can be achieved so as to obtain good Quality Ni-Cu-P plating and Ni-Cu-P / Ni-P double plating. Electroless Ni-Cu-P / Ni-P dual-layer coating due to the relatively good distribution of internal stress, and have excellent coating adhesion. Studies have shown that double-layer electroless plating is an effective way to improve the bonding strength of Ni-P coatings.