90年代后半期兴起的热门封装技术,芯片尺寸封装技术(CSP,chip-scale packaging)正在帮助便携式和台式计算机的制造商将内存容量提高一倍,而仍然仅仅占用原来使用小型封装(TSOP)做成的模块时所占用的同样大小的空间。Kingmax微技术公司(位于美国加州的Irvine),推出一种采用TinyBGA封装(一种CSP封装形式)的模块,将DRAM模块的尺寸(与原先采用TSOP封装的模块相比)缩小50％。 例如,一种64M字节DRAM芯片采用TinyBGA封装后,尺寸为:0.35(L)(0.47(W)in,而如果采用 Popular packaging technology, chip-scale packaging (CSP), which emerged in the late 1990s, is helping manufacturers of portable and desktop computers double the amount of memory while still remaining in the original TSOP Into the module occupied by the same size of space. Kingmax Micro Technologies, Irvine, CA, introduced a module in the TinyBGA package, a CSP package, that shrinks the size of the DRAM module by 50% compared to the original TSOP-packaged module. For example, a 64M byte DRAM chip in TinyBGA package size: 0.35 (L) (0.47 (W) in, and if used