随着消费类电子与移动通讯产品的快速普及,相关电子产品功能整合日趋多样化,在外观设且计薄型化与产品开发周期日益缩短等双重压力下,IC器件尺寸则不断缩小且运算速度不断提高,封装技术已成为极为关键的技术。封装形式的优劣已影响到IC器件的频率、功耗、复杂性、可靠性和单位成本。S i P(系统级封装System In a Package)综合运用现有的芯片资源及多种先进封装技术的优势,有机结合起来由几个芯片组成的系统构筑而成的封装,开拓了一种低成本系统集成的可行思路与方法,较好地解决了 With the rapid popularization of consumer electronics and mobile communication products, the functional integration of related electronic products is increasingly diversified. Under the dual pressures of thinner appearances and shorter product development cycles, the size of IC devices continues to shrink and the computing speed continues Enhancement, packaging technology has become a crucial technology. The advantages and disadvantages of the package have affected the IC device frequency, power consumption, complexity, reliability and unit cost. S i P (System In Package) System By combining the advantages of existing chip resources and a variety of advanced packaging technologies, the combination of an organic package formed by a system of several chips opens up a low cost System integration feasible ideas and methods, a better solution