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采用Ni、V、Cu等填充材料进行钛合金与不锈钢的电子束焊接实验。采用光学显微镜、扫描电镜及X射线衍射对接头的微观组织进行分析。通过抗拉强度和显微硬度评价接头的力学性能,分析讨论填充材料对钛/钢电子束焊接接头微观组织和力学性能的影响。结果表明:填充材料有助于抑制Ti-Fe金属间化合物的产生。所有接头均由固溶体和界面化合物组成。对于不同的填充材料,固溶体和界面化合物种类取决于填充材料与母材之间的冶金反应。对于Ni、V及Cu填充材料,界面化合物分别为Fe2Ti+Ni3Ti+NiTi2,TiFe和Cu2Ti+CuTi+CuTi2。接头抗拉强度主要取决于金属间化合物的脆性。采用Cu填充金属的接头抗拉强度最高,约为234 MPa。
Ni, V, Cu and other filler materials for titanium alloy and stainless steel electron beam welding experiments. The microstructure of the joint was analyzed by optical microscope, scanning electron microscopy and X-ray diffraction. The mechanical properties of the joints were evaluated by tensile strength and microhardness. The effects of filler on the microstructure and mechanical properties of titanium / steel electron beam welded joints were analyzed. The results show that the filler material can help to inhibit the generation of Ti-Fe intermetallic compounds. All joints consist of solid solution and interface compounds. For different filler materials, the type of solid solution and interfacial compound depends on the metallurgical reaction between the filler material and the base metal. For Ni, V and Cu filler materials, the interface compounds are Fe2Ti + Ni3Ti + NiTi2, TiFe and Cu2Ti + CuTi + CuTi2, respectively. Joint tensile strength mainly depends on the brittleness of intermetallic compounds. Tensile strength was highest at joints filled with Cu, about 234 MPa.