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为研究纳米梁的力学特性,采用SOI晶圆制备了硅双端固支梁纳米梁,利用典型的原子力显微镜(AFM)弯曲测试方法测试了硅纳米梁〈100〉晶向的杨氏模量.AFM悬臂探针定位在纳米梁的中点处向下移动,纳米梁受到挤压发生弹性形变,形变过程存在一个最大形变点,在该点后,纳米梁被挤压在SOI硅片底层硅上.最大形变前的测试数据用于计算力-位移曲线斜率,最大形变后的测试数据用于计算探针的灵敏度,其实验值分别为0.792N/m和81.83nm/V.最终得到的杨氏模量为104GPa,该值小于体硅的杨氏模量,表面应力和缺陷可能是导致实验值偏小的原因.
In order to study the mechanical properties of nano-beams, silicon double-ended beams were prepared by SOI wafer. The Young’s modulus in the <100> orientation of Si nano-beams was tested by a typical atomic force microscope (AFM) bending test. The AFM cantilever probe moves downward at the midpoint of the nanowire. The nanowire is elastically deformed by extrusion and has a maximum deformation point during deformation. After that point, the nanowire is pressed against the silicon on the SOI wafer The maximum pre-deformation test data is used to calculate the slope of the force-displacement curve, and the maximum deformation test data is used to calculate the probe sensitivity with experimental values of 0.792 N / m and 81.83 nm / V respectively. The resulting Young’s With a modulus of 104 GPa, which is less than the Young’s modulus of bulk silicon, surface stresses and defects may be responsible for the small experimental values.