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Three kinds of full compositional distribution (from 0 to 100wt%W) W/Cu FGMs (functionally graded materials) with high density is fabricated by resistance sintering under ultra-high pressure. Microstructure analysis showed that the good grading composition of all FGMs has been obtained. The sintering mechanism of W is mainly solid state sintering. Thermal shock test in air demonstrated that the grading at the interface between W and Cu is effective for the reduction of thermal stress, but obvious transver- se and vertical cracks occur in the pure W layer. The oxidation of the W60Cu40 layer and the W40Cu60 layer is heavier than that of the other layers.
W / Cu FGMs (functionally graded materials) with high density is fabricated by resistance sintering under ultra-high pressure. Microstructure analysis showed that the good grading composition of all FGMs has been The sintering mechanism of W is mainly solid state sintering. The shock mechanism in W was mainly solid state sintering. The shock mechanism in the solid interface sintering of the grading at the interface between W and Cu is effective for the reduction of thermal stress, but obvious transversal and vertical cracks occur in the pure The oxidation of the W60Cu40 layer and the W40Cu60 layer is heavier than that of the other layers.