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一、前言为测定电真空纯银焊料中有害杂质及其他用途的纯银中的杂质,要求有一个迅速准确的测定方法。因化学分析周期长,故采用光谱分析。现有资料测定纯银中杂质的种类少(如资料使用硝酸银粉末法仅测定锑、铅、铁、铋四种杂质元素),检测范围较小,不能适应当前生产和科研对纯银中杂质鉴定的要求,这就需探索一种分析杂质多、速度快、分析范围宽的新方法。据此,参考了国内外有关资料通过多次试验,确定了一个使用硝酸银粉末法直流电弧技术测定纯银及高纯银中铅、铋、锌、镉、铁、镁、铜、铝、锡、硅、锑、锰、碲、镍、钴、锂、钛、钙、汞等19种杂质的光谱化学分析方法。
I. INTRODUCTION In order to determine the impurities in pure silver in electric vacuum sterling silver solder and other pure silver, a rapid and accurate determination method is required. Due to the long chemical analysis cycle, the use of spectral analysis. Existing data to determine the type of impurities in pure silver (such as the use of silver nitrate powder method only the determination of antimony, lead, iron, bismuth four kinds of impurity elements), the detection range is small, can not adapt to the current production and research of pure silver impurities Identification of the requirements, which need to explore a new method of analysis of impurities, high speed, wide range of analysis. Accordingly, with reference to relevant domestic and international information through several experiments, a determination of lead, bismuth, zinc, cadmium, iron, magnesium, copper, aluminum, tin and silicon in pure silver and high purity silver was determined by direct current arc technique with silver nitrate powder method , Antimony, manganese, tellurium, nickel, cobalt, lithium, titanium, calcium, mercury and other 19 kinds of impurities spectrochemical analysis method.