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目的探讨半导体激光预防下颌阻生第三磨牙拔除术后肿胀和疼痛的效果。方法选择需拔除双侧下颌阻生第三磨牙的患者20例,其中男性9例,女性11例;年龄17~42岁,平均年龄27.55岁。随机将一侧设为试验组,另一侧为对照组。试验组采用左布比卡因行下牙槽神经、舌神经及颊长神经麻醉,切开翻瓣,采用涡轮钻去骨劈冠,用微创牙挺分块拔除患牙,缝合伤口,术后口服阿莫西林,并用激光口腔治疗仪照射口内拔牙创口及拔牙创口对应颊部各5min,每天1次,连续5d,术后7d拆线。对照组除不用激光照射治疗外,其他治疗措施同试验组。观察术后肿胀和疼痛情况。结果术后第1、2、3、5天肿胀程度和第1、2、3天疼痛程度两组间差异有统计学意义(P<0.05)。术后第7天的肿胀程度和第5、7天疼痛程度两组间差异无统计学意义(P>0.05)。结论半导体激光照射治疗能减轻下颌阻生第三磨牙拔除术后肿胀、疼痛。
Objective To investigate the effect of semiconductor laser on swelling and pain after mandibular third molar extraction. Methods Twenty patients with mandibular impacted third molars were selected, including 9 males and 11 females, aged 17-42 years, with an average age of 27.55 years. Randomly set one side as the test group and the other side as the control group. The experimental group was treated with levobupivacaine under the alveolar nerve, the lingual nerve and the cheek long nerve, the flap was dissected, the turbinate was used to cut the bone, the minimally invasive denture was used to remove the affected tooth, and the wound was sutured After oral administration of amoxicillin, and dental laser treatment instrument mouth mouth extraction mouth and tooth extraction corresponding cheek each 5min, day 1, continuous 5d, 7d after stitches. In addition to the control group without laser irradiation treatment, the other treatment with the experimental group. Postoperative swelling and pain were observed. Results The degree of swelling on day 1, 2, 3 and 5 after operation and the pain on day 1, 2 and 3 were significantly different between the two groups (P <0.05). The degree of swelling on the 7th postoperative day and the pain on the 5th and 7th day were not statistically different between the two groups (P> 0.05). Conclusion Laser diode laser irradiation can relieve swelling and pain after extraction of mandibular impacted third molars.