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在Au丝热超声球形键合工艺中,焊点的特征(如球径和键合强度)取决于工艺参数值的选择。为了研究关键工艺参数超声振幅、键合时间和压力对键合形成的影响,进而找到最优的键合参数,采用响应曲面法(RSM)并结合工艺稳健性和多响应优化的思想,建立了关键参数与响应之间的统计模型,优化了键合参数。首先,以焊球直径和剪切力的均值与方差作为目标响应,建立其与工艺参数之间的响应曲面模型。然后,采用满意度函数法(DFA)得到总体满意度最大的解,即最优的工艺参数组合。最后,通过试验验证了该方法的有效性。
In the Au wire thermosonic ball bonding process, the characteristics of the solder joint (such as ball diameter and bond strength) depend on the choice of process value. In order to study the effect of key parameters such as ultrasonic amplitude, bonding time and pressure on bond formation, and to find the optimal bonding parameters, the response surface methodology (RSM) combined with the idea of process robustness and multiple response optimization The statistical model between the key parameters and the response optimizes the bonding parameters. First, taking the mean value and variance of the solder ball diameter and shear force as the target responses, a response surface model between the parameters and the process parameters is established. Then, the satisfaction degree function method (DFA) is used to get the solution with the highest overall satisfaction, that is, the optimal combination of process parameters. Finally, the validity of this method is verified through experiments.