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介绍了利用红外热成像技术诊断印制电路板故障的原理及系统的硬件组成和软件设计。该诊断方式新颖，具有直观、非接触性、诊断速度快和准确性高等特点。
Introduced the principle of using infrared thermal imaging technology to diagnose the fault of printed circuit board and the hardware composition and software design of the system. The diagnostic method is novel, with intuitive, non-contact, diagnostic speed and accuracy of higher features.