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提出了一种新型多晶硅薄膜热膨胀系数的电测试结构,给出了热机电耦合模型和测试方法,并利用Coventor软件和ANSYS软件进行模拟和验证.分析表明模拟结果和理论结果基本一致,从而验证了该模型.该方法能够实现多晶硅薄膜热膨胀系数的在线提取,测量方便,独立性较高,以电学量形式输出,对于薄膜热膨胀系数的在线检测有一定参考价值.
An electrical test structure of the thermal expansion coefficient of polycrystalline silicon thin film was proposed, and the thermal electromechanical coupling model and test method were given. The software and ANSYS software were used to simulate and verify the results. The analysis shows that the simulation results are in good agreement with the theoretical results, This method can realize the online extraction of thermal expansion coefficient of polycrystalline silicon thin film, and has the advantages of convenient measurement, high independence and output in the form of electrical quantity, which is of certain reference value for on-line detection of thermal expansion coefficient of the film.