D触发器用途广泛,需求量很大,因此如何提高其成品率就成为一个重要的课题。从现有工艺实际出发,我们对提高双极型D触发器成品率采取了若干工艺措施,取得了一定成效。关于前道芯片成品率方面的工作我们已作过系统地讨论,这里作些补充叙述,而以较大篇幅进一步讨论光刻质量方面的若干工艺细节,同时还着重介绍提高封装成品率方面的工艺措施。 D flip-flop wide range of uses, demand is very large, so how to improve its yield has become an important issue. Proceeding from the actual process, we have taken some technical measures to improve the yield of the bipolar D flip-flop, and achieved some results. We have systematically discussed the work on front-end die yield, which we will cover a bit further, and discuss further process details of lithography quality in greater detail, with a focus on processes to improve package yield Measures.