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用静止液滴法测定了纯铜在熔点到1500℃温度范围内的加热和冷却过程中表面张力随温度的变化。结果表明:纯铜的表面张力温度系数为—0.470达因/厘米·度。如果样品中残存有某些微量表面活性杂质,它将使表面张力剧烈下降,在升温过程中,这些杂质不断减少,因而表面张力将随温度的上升而增加,且在1350℃出现极大值。
The static drop method was used to measure the change of surface tension with temperature during the heating and cooling process of pure copper in the temperature range from the melting point to 1500 ℃. The results show that the temperature coefficient of surface tension of pure copper is -0.470 dyne / cm degree. If some trace amounts of surface-active impurities remain in the sample, it will cause a sharp drop in surface tension. As these impurities continue to decrease during the heating process, the surface tension will increase with increasing temperature and will reach a maximum at 1350 ° C.