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系统研究了乙二胺树脂(PSA)对铜Cu(Ⅱ)和磺胺甲恶唑(SMZ)污染物的共去除性能及交互影响规律。研究结果表明,PSA对Cu(Ⅱ)和SMZ的吸附等温线可采用Langmuir方程进行拟合,共存不同浓度SMZ时,Cu(Ⅱ)的饱和吸附量升高(18.11~32.9%);共存不同浓度Cu(Ⅱ)时,SMZ的饱和吸附量降低(2.18~36.5%)。结合预负载、动态吸附实验及固相FT-IR分析,低SMZ浓度时,Cu(Ⅱ)的增强去除主要是由于质子化氨基被阴离子SMZ-吸附,屏蔽了正电荷对Cu(Ⅱ)的静电排斥作用。Cu(Ⅱ)与SMZ分别与PSA中的氨基发生配位作用和静电/氢键作用,因而存在竞争吸附,且Cu(Ⅱ)的吸附作用力更强;固相中Cu(Ⅱ)对SMZ具有架桥吸附作用,形成了-N-Cu(Ⅱ)-SMZ三元络合物构型。用1.0mol/L的HCl对吸附后的PSA进行再生,SMZ和Cu(Ⅱ)的再生率分别达98.2%和99.8%。共存无机盐显著促进了Cu(Ⅱ)的吸附(4.7~42.7%),略抑制了SMZ的吸附(1.6~19.4%),而共存腐植酸对两种目标污染物的去除基本无影响。
The co-removal behavior and interaction of ethylene-diamine resin (PSA) on Cu (Ⅱ) and sulfamethoxazole (SMZ) pollutants were systematically investigated. The results showed that the adsorption isotherms of Cu (Ⅱ) and SMZ by PSA were fitted by Langmuir equation. The adsorption capacity of Cu (Ⅱ) increased with the increase of the concentration of CuZ (18.11 ~ 32.9% When Cu (Ⅱ), the saturated adsorption capacity of SMZ decreased (2.18 ~ 36.5%). Combined with pre-loading, dynamic adsorption experiments and FT-IR analysis, the enhanced removal of Cu (Ⅱ) at low SMZ concentrations was mainly due to the adsorption of protonated amino groups on the anion SMZ-, shielding the electrostatic charge of Cu (Ⅱ) Exclusion The competitive adsorption of Cu (Ⅱ) and SMZ with amino groups in PSA and electrostatic / hydrogen bonding, respectively, led to the stronger adsorption of Cu (Ⅱ); the Cu (Ⅱ) Bridge adsorption, forming a -N-Cu (Ⅱ) -SMZ ternary complex configuration. After the PSA was regenerated with 1.0 mol / L HCl, the regeneration rates of SMZ and Cu (Ⅱ) reached 98.2% and 99.8% respectively. The coexistence of inorganic salts significantly promoted the adsorption of Cu (Ⅱ) (4.7-42.7%), slightly inhibited the adsorption of SMZ (1.6-19.4%), while the coexistence of humic acid had no effect on the removal of the two target pollutants.